Bergquist Hi-Flow 225UT导热绝缘相变化材料

材料生产商：美国贝格斯（BERGQUIST）公司研发产品

Hi-Flow 225UT可供规格：

厚度： 0.077mm  0.127mm

片材： 279.4 mm*304.8 mm

卷材：  279.4mm*76.2 m

相变化温度：55℃

导热系数：0.7W/m-K

表面粘性：双面自带黏性

颜色：黑色

Hi-Flow 225UT应用材料特性：

压敏相变化导热界面材料，具有天然粘性的55℃相变化复合物，高可视度的保护膜拉片

Hi-Flow 225UT材料说明：

Hi-Flow 225UT是一款设计应用于高性能处理器的发热元器件和散热器之间导热的压敏界面材料，它是一种具有天然粘性的55℃相变化复合物，该材料背面有PET离型膜，正面附有高可视度的保护膜拉片。一旦达到55℃的相变化温度，Hi-Flow 225UT立刻润湿导热界面，流动的特性带来最低的热阴，装配时需要一定的压力让材料流动，流动时涂层不会滴漏。

Hi-Flow 225UT典型应用：

弹片/扣具安装

独立的功率半导体和模块

Hi-Flow 225UT技术优势分析：

可按客户尺寸模切，仅限于正方形和长方形.提供经过模切的卷材制品，啤半穿、除废料，附有拉片（不能有孔）

Hi-Flow® 225UT is designed as a pressure sensitive thermal interface material for use between a high performance processor and a heat sink. Hi-Flow® 225UT is a thermally conductive 55°C phase change composite with inherent tack. The material is supplied on a polyester carrier liner and is available with high-visibility protective tabs. Above its phase change temperature,

Hi-Flow® 225UT wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance. The material requires pressure of the assembly to cause flow. Hi-Flow® 225UT coatings will resist dripping.

Application Methods

 1. Hand-apply Hi-Flow® 225UT to a room- temperature heat sink. The Hi-Flow® 225UT pad exhibits inherent tack and can be hand-applied similar to an adhesive pad. The tab liner can remain on the heat sink and pad throughout shipping and handling until is it is ready for final assembly.